Samsung Exynos 2600 Spec Sheet: 2nm GAA Node Destroys Thermal Throttling

Manufacturer: Samsung Electronics (System LSI)

Model Number: S5E9965

Release/Date Quarter: Q4 2025 (Announced December 19, 2025)

Class/Tier: Flagship

Official Page: samsung.com/exynos-2600


The 2nm GAA Pioneer: Samsung’s Exynos 2600 makes history as the world’s first mobile SoC forged on a 2-nanometer Gate-All-Around (GAA) node, driving an aggressive deca-core layout up to 3.8 GHz.
The Desktop GPU Upgrade: Armed with an AMD RDNA 4-based Xclipse 960 GPU, it smashes ray tracing benchmarks while introducing AI-powered frame generation and super sampling.
The Wattage Price Tag: This unprecedented performance stability demands a massive 30.22W peak power draw, meaning intensive uncapped gaming will drain battery reserves rapidly.
Inside This Audit: We deeply analyze raw deca-core benchmarks, the unique external modem choice, 59 TOPS NPU performance, and real-world thermal metrics.
The Ultimate Question: Has Samsung finally broken its historical thermal curse or simply hidden an inefficient power trap? Let’s check the data.

Official Samsung Exynos 2600 2nm GAA flagship processor chip render showing metallic detailing and architectural layout.

🏆 MultiCore Performance Overall Score

Overview & Core Features

ParameterValue
Architecture & Fabrication ⭐⭐⭐⭐⭐96%
CPU Capabilities (Granular) ⭐⭐⭐⭐⭐95%
GPU & Graphics ⭐⭐⭐⭐⭐98%
NPU & AI Engine ⭐⭐⭐⭐88%
Memory & Storage Support ⭐⭐⭐⭐⭐95%
ISP and Camera ⭐⭐⭐⭐⭐96%
Display and Multimedia⭐⭐⭐⭐⭐98%
Connectivity and Modem ⭐⭐⭐⭐⭐94%
Benchmarks ⭐⭐⭐⭐⭐96%
Thermals and Effeciency ⭐⭐⭐⭐⭐94%
ParameterValue
OVERALL SCORE ⭐⭐⭐⭐⭐95/100

🦾 Architecture & Fabrication

Defines the silicon lithography and foundational instruction set.

Architecture & Fabrication Details

process node
2nm GAA (Samsung SF2)
foundary
Samsung
Instruction Set Architecture (ISA)
ARMv9.3-A
Total cores
10 (Deca-core)

🖥️ CPU Capabilities (Granular)

Evaluates raw processing power, core clustering, and cache layout.

CPU Cores & Clock Speed Layout

cluster 1 (prime)
Arm C1-Ultra, 1 Core, 3.8 GHz
Cluster 2 (performance)
Arm C1-Pro, 3 Cores, 3.25 GHz
cluster 3 (effeciency)
Arm C1-Pro, 6 Cores, 2.75 GHz (Underclocked Performance Cores)
cache memory
L1: 192 KB per core, L2: 3 MB, L3: 16 MB Shared

🎮 GPU & Graphics

Highlights graphics rendering power, ray tracing, and gaming capabilities.

GPU & Gaming Graphics Engine

GPU Name
Samsung Xclipse 960 (AMD RDNA 4 Architecture)
GPU Clock Speed
980 MHz
Hardware Ray Tracing Support
Yes
Compute Performance (FP32)
4.01 TFLOPS (4014.1 Gigaflops)

🤖 NPU & AI Engine

Measures on-device machine learning capabilities and total compute TOPS

NPU & AI Processing Power

NPU Name
AI Engine with 32K MAC NPU (Distributed 6-Core Complex)
total tops
59 TOPS

💾 Memory & Storage Support

Specifies memory bandwidth, RAM generations, and storage interface speeds

RAM & Storage Support

Ram Type
LPDDR5X
Storage interface
UFS 4.1
ParameterValue
RAM Max Frequency5333MHz
RAM Max Bandwidth85.3GB/s

🎥 ISP and Camera

Details image signal processing, sensor support, and video encoding

Camera ISP & Video Capabilities

ISP Name
Visual Perception System (VPS) ISP
Max Camera Support
320 MP
Max Video Capture
8K @ 30 fps
Codec Decoding/Encoding
HEVC (H.265), H.264, VP9, AV1, APV Codec

📺 Display and Multimedia

Outlines on-device display resolution, external monitor support, and decoding

Display Resolution & Multimedia

Max On-Device Resolution
4K / WQUXGA @ 120 Hz
External Display Support
Yes (Max Res: N/A, natively via embedded DisplayPort over USB-C)
HDR Standard
HDR10, HDR10+, HLG, Dolby Vision
Video playback
8K @ 60 fps

🌐 Connectivity and Modem

Covers cellular modem capabilities, Wi-Fi standards, and network speeds

5G Modem & Wireless Connectivity

Modem Name
Exynos Modem 5410 (Shannon 5410)
4G/5G Support
Sub-6 GHz, mmWave (NSA/SA)
Max Download/Upload Speed
14.79 Gbps / N/A
Wi-Fi Standard
Wi-Fi 7 (802.11be) via external S6568 companion chip
Bluetooth Version
Bluetooth 6.1
Navigation
N/A (Handled via external chip)

Benchmarks & Performance Metrics

Analyzes synthetic test scores across popular performance benchmarking platforms

AnTuTu v11 Score

The AnTuTu Benchmark measures CPU, GPU, RAM, and I/O performance in different scenarios to reveal real-world bottlenecks and latency issues.

ParameterValue
Exynos 26003113347
ParameterValue
CPU1030159
GPU1215533
Memory383071
UX484584

Geekbench 6

The GeekBench test shows raw single-threaded and multithreaded CPU performance, providing precise data on computational throughput and efficiency under load.

ParameterValue
Single-Core3220
Multi-Core11249

3D Mark

A cross-platform benchmark that assesses graphics performance in Vulkan (Metal) ensures fair GPU comparisons across operating systems and hardware configurations.

ParameterValue
3DMark Steel Nomad Light3109
3DMark Solar Bay11935
3DMark Wild Life Extreme7250

PCMark 3.0

Benchmark for evaluating overall system performance in everyday workloads ties all results together, simulating real tasks for a holistic view of responsiveness and daily computing speed clearly.

ParameterValue
PCMark 3.020423
ParameterValue
Web score21279
Video editing score8171
Photo editing score40764
Writing score30248

🌡️ Thermals and Effeciency

Measures sustained workload stability and peak power consumption metrics

Thermals, Power Draw & Efficiency

ParameterValue
3D Mark Stability94%
Power Draw30.22W

🏆 MultiCore Performance Final Verdict

CRITERIARATINGEXPLANATION
Sustained Stability⭐⭐⭐⭐⭐Legendary 94% stability in 3DMark loops achieved via Heat Pass Block (HPB) design.
GPU Ray Tracing⭐⭐⭐⭐⭐Desktop-class AMD RDNA 4 architecture utterly decimates graphics processing with dedicated hardware accelerators.
Multi-Thread CPU⭐⭐⭐⭐⭐Aggressive 1+3+6 deca-core configuration swaps out tiny cores for active C1-Pro architectures.
AI Processing⭐⭐⭐⭐Highly distributed 59 TOPS NPU with local scratchpad RAM; includes industry-first Post-Quantum Cryptography.
Memory Architecture⭐⭐⭐⭐⭐Decoupled RAM placement prevents insulating blankets
Thermal Packaging⭐⭐⭐⭐⭐Fan-out Wafer Level Packaging and HPB drop temperatures by 30%
Peak Power Draw⭐⭐Brute force physical demand a staggering 30.22W MultiCore burst

chip name: Who Is It For?

✅ BUY IF YOU…❌ DON'T BUY IF YOU…
Demand flawless sustained gaming, as the Heat Pass Block achieves an unprecedented 94% performance stability under stress.Prioritize absolute day-long battery lifespans, since an unthrottled 30.22W peak consumption will deplete active power fast.
Require top-tier mobile ray tracing, leveraging AMD RDNA 4 architectures and Exynos Neural Super Sampling upgrades.Rely heavily on unpatched legacy apps, as early RDNA 4 drivers currently restrict specific BCn texture compression formats.
Want elite multi-window workflows, utilizing six active underclocked performance cores to clear tasks at rapid speeds.Chase absolute single-core benchmark records, because the strict 3.80 GHz ceiling can trail top tier single-threaded bursts.
Value cinematic RAW videography, taking advantage of semantic VPS ISP rendering and Samsung’s custom APV studio codec.Are buying the top-end Galaxy S26 Ultra, which bypasses this chip entirely to utilize global Qualcomm architectures.

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