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Snapdragon 8s Gen 3 vs Dimensity 9400+: Specs Sheet And Review

โ€‹Quick Verdict:

โ€‹The MediaTek Dimensity 9400+ operates as an absolute brute-force benchmark leviathan, eclipsing the Qualcomm Snapdragon 8s Gen 3 by up to 132% in raw graphics and 80% in multi-core processing power. However, this raw muscle commands a massive 11.4W power envelope that tanks extended stability to a low 52.0%. The binned Snapdragon 8s Gen 3 handles thermals far more gracefully, drawing just 5.8W to lock in a rock-solid 87.1% frame-time consistency. The hard truth: Choose MediaTek if you demand peak frame rates and next-gen AI immediately; choose Qualcomm if you want unthrottled, cool gaming performance that outlasts the competition over long sessions. Stick around to see how these radically different architectures handle real-world heat saturation.

MultiCore Metric

Calculated Index: Geekbench 6 Multi-Core split directly against Peak Power Draw to isolate true performance-per-watt efficiency

MultiCore Efficiency Index (MCEI) True Performance Per Watt Effeciency Score

ParameterValue
Snapdragon 8s Gen 3 (Efficiency Winner) ⭐⭐⭐⭐⭐810.7 MCEI
Dimensity 9400 Plus ⭐⭐⭐⭐742.4 MCEI

8s Gen 3

Manufacturer: Qualcomm

Model Number: SM8635

Release/Date Quarter: Q1 2024 (March 2024)

Class/Tier: Sub-Flagship / Flagship Killer

Official Page: qualcomm.com/snapdragon-8s-gen-3

Dimensity 9400+

Manufacturer: MediaTek

Model Number: MT6991

Release/Date Quarter: Q2 2025 (April 2025)

Class/Tier: Ultra-Flagship / Premium

Official Page: mediatek.com/mediatek-dimensity-9400-plus


Split graphic comparing a gold Snapdragon 8s Gen 3 chip on a red background on the left with a black MediaTek Dimensity 9400+ chip on a dark background on the right.
Dimensity 9400+ wins all the benchmark tests, why I say the Snapdragon 8s Gen 3 is actually better for long gaming sessions?

Benchmarks measure a short sprint; real gaming is a marathon.
Dimensity peaks incredibly high but pulls 11.4W of power, heats up fast, and then drops to 52% stability. Snapdragon sips only 5.8W, stays cool, and holds a rockโ€‘steady 87.1% stability.
✅ Takeaway: For a quick burst the Dimensity is a beast; for hours of smooth, uninterrupted play, Snapdragon is the clear winner.

Which chip will give me better battery life and a phone that doesnโ€™t feel hot?

Snapdragon 8s Gen 3. It draws half the power (5.8W vs 11.4W) under heavy load, generating far less heat and giving you noticeably longer screenโ€‘on time.
✅ Takeaway: If cool, longโ€‘lasting battery life matters more than raw peak performance, go with Snapdragon.

Dimensity has an 80% higher multiโ€‘core score โ€” does that mean apps open much faster and multitasking feels completely different?

Not for everyday use. The 80% advantage only appears in extreme allโ€‘core benchmarks. Daily tasks like switching between apps, browsing, or texting rarely push all cores to 100%. Both chips feel fast and fluid. Plus, the Snapdragon stays cooler, so its speed doesnโ€™t fade after heavy use.
✅ Takeaway: Benchmark numbers donโ€™t translate into a dramatically different daily feel โ€” both are snappy, and Snapdragon stays consistent.

Dimensity 9400+ is a true flagship, while the Snapdragon 8s Gen 3 is a โ€˜subโ€‘flagshipโ€™. Doesnโ€™t that automatically make the Dimensity the better chip?

Not automatically โ€” it depends on what you value.
Dimensity gives you spectacular peak performance right now, but at the cost of more heat and power. Snapdragon is a balanced, reliable workhorse that delivers great speed, longer battery life, and cooler handling without throttling.
✅ Takeaway: Flagship doesnโ€™t always mean better overall. For many, Snapdragonโ€™s dependable, allโ€‘day stamina is actually the smarter choice.

I play graphicsโ€‘heavy games like Genshin Impact or Call of Duty for hours. Which chip should I pick?

Snapdragon 8s Gen 3. Dimensity starts with stunning frame rates but heats up quickly and throttles, causing stutter. The Snapdragonโ€™s lower power draw keeps the phone cool and frame rates smooth from start to finish.
✅ Takeaway: For long, comfortable gaming sessions without a handโ€‘warmer effect, Snapdragon is the pick.


🏆 MultiCore Performance Overall Score

Overview & Core Features

Architecture & Fabrication

ParameterValue
8s Gen 3 ⭐⭐⭐⭐80%
Dimensity 9400+⭐⭐⭐⭐⭐94%

CPU Capabilities (Granular)

ParameterValue
8s Gen 3 ⭐⭐⭐72%
Dimensity 9400+ ⭐⭐⭐⭐⭐96%

GPU & Graphics

ParameterValue
8s Gen 3 ⭐⭐⭐65%
Dimensity 9400+ ⭐⭐⭐⭐⭐99%

NPU & AI Engine

ParameterValue
8s Gen 3 ⭐⭐⭐⭐75%
Dimensity 9400+ ⭐⭐⭐⭐⭐98%

Memory & Storage Support

ParameterValue
8s Gen 3 ⭐⭐⭐⭐70%
Dimensity 9400+ ⭐⭐⭐⭐⭐98%

ISP and Camera

ParameterValue
8s Gen 3 ⭐⭐⭐⭐85%
Dimensity 9400+ ⭐⭐⭐⭐⭐96%

Display and Multimedia

ParameterValue
8s Gen 3 ⭐⭐⭐⭐75%
Dimensity 9400+ ⭐⭐⭐⭐⭐90%

Connectivity and Modem

ParameterValue
8s Gen 3 ⭐⭐⭐⭐⭐88%
Dimensity 9400+ ⭐⭐⭐⭐85%

Benchmarks

ParameterValue
8s Gen 3 ⭐⭐⭐85%
Dimensity 9400+ ⭐⭐⭐⭐⭐92%

Thermals and Effeciency

ParameterValue
8s Gen 3 ⭐⭐⭐⭐⭐87%
Dimensity 9400+ ⭐⭐⭐52%

OVERALL SCORE

ParameterValue
8s Gen 3 ⭐⭐⭐⭐76/100
Dimensity 9400+ ⭐⭐⭐⭐⭐91/100

🦾 Architecture & Fabrication

Defines the silicon lithography and foundational instruction set.

Architecture & Fabrication Details

process node
4nm
3nm N3E
foundary
TSMC
TSMC
Instruction Set Architecture (ISA)
ARMv9.2-A ISA
ARMv9.2-A ISA
Total cores
8 Cores (1+4+3 layout)
8 Cores (1+3+4 All-Big-Core layout)

🖥️ CPU Capabilities (Granular)

Evaluates raw processing power, core clustering, and cache layout.

CPU Cores & Clock Speed Layout

cluster 1 (prime)
1x Cortex-X4 @ 3.00 GHz
1x Cortex-X925 @ 3.73 GHz
Cluster 2 (performance)
4x Cortex-A720 @ 2.80 GHz
3x Cortex-X4 @ 3.30 GHz
cluster 3 (effeciency)
3x Cortex-A520 @ 2.00 GHz
4x Cortex-A720 @ 2.40 GHz
cache memory
1MB L2 (X4), 8MB L3, 0MB SLC
2MB L2 (X925), 12 MB L3, 10 MB SLC

Data Review:

MediaTek completely eliminates small efficiency cores, deploying a massive 19MB total cache hierarchy on a cutting-edge 3nm process to prevent instruction starvation. Qualcomm aggressively prunes its silicon footprint by 35% and cuts cache allocations in half, trading elite processing peaks for standard daily operations efficiency.


🎮 GPU & Graphics

Highlights graphics rendering power, ray tracing, and gaming capabilities.

GPU & Gaming Graphics Engine

GPU Name
Adreno 735
Immortalis-G925 MC12
GPU Clock Speed
1100 MHz
1612 MHz
Hardware Ray Tracing Support
via Snapdragon Elite Gaming
with Opacity Micromaps (OMM)
Compute Performance (FP32)
1.68 TFLOPS
4.95 TFLOPS
GaminG Leap
Tile Memory Heap

Variable Rate Shading (VRS)
Fragment Prepass technology

MAGT 3.0

MFRC 3.0

Data Review:

Immortalis-G925 MC12 functions as a graphics titan, nearly tripling the raw floating-point mathematical compute performance of the binned Adreno 735. Its built-in Fragment Prepass pipeline processes geometry depth entirely on the GPU, lowering CPU overhead by 43% to drive complex light physics and advanced ray-tracing models smoothly.


💾 Memory & Storage Support

Specifies memory bandwidth, RAM generations, and storage interface speeds

RAM & Storage Support

Ram Type
Quad-channel LPDDR5X
Quad-channel LPDDR5X
Storage interface
UFS 4.0
UFS 4.1 with Multi-Circular Queue (MCQ)

RAM Frequently

ParameterValue
8s Gen 34200 MHz
Dimensity 9400+5333 MHz

RAM Bandwidth

ParameterValue
8s Gen 367.2 GB/s
Dimensity 9400+85.3 GB/s

Data Review:

Qualcomm implements strict frequency thresholds on its memory controllers to target the upper-mid-range bracket. MediaTek runs a significantly wider data pipeline, combining extreme RAM frequencies with multi-circular flash storage queuing to eliminate standard I/O data bottlenecks.


🤖 NPU & AI Engine

Measures on-device machine learning capabilities and total compute TOPS

NPU & AI Processing Power

NPU Name
Fused Hexagon NPU architecture
MediaTek NPU 890
total tops
unverified
50 TOPS
Extra leap in ai
Supports 10-billion parameter models locally

Integrated Qualcomm Sensing Hub for multimodal context background analysis
Native hardware acceleration for Mixture-of-Experts (MoE) architectures and Speculative Decoding+ (SpD+)

Directly runs advanced local multi-modal parameters like DeepSeek-R1-Distill.

Data Review:

While both platforms execute localized small language models cleanly, the execution speed of generative AI is heavily bound by system memory speeds. MediaTek’s faster 5333 MHz memory controller grants an 11.1% raw bandwidth advantage that significantly accelerates local token generation rates.


🎥 ISP and Camera

Details image signal processing, sensor support, and video encoding

Camera ISP & Video Capabilities

ISP Name
Qualcomm Spectra 18-bit Triple Cognitive
MediaTek Imagiq 1090
Max Camera Support
200 MP
320 MP
Max Video Capture
4K UHD @ 60 FPS
8K @ 60 FPS
Codec Decoding/Encoding
AV1, H.265,
AV1, H.265
extra leap in camera
support for Dolby Vision, HDR10+, and real-time semantic capture mapping
uncompressed AI segmentation loops and hardware-level low-light noise reduction layers

Data Review:

Qualcomm’s 18-bit Spectra ISP handles computational color grading accurately, but it drops 8K capture configurations entirely. MediaTek targets premium content creation directly by enabling ultra-high-resolution 320MP support and full-speed 8K60 HDR studio recording files.


📺 Display and Multimedia

Outlines on-device display resolution, external monitor support, and decoding

Display Resolution & Multimedia

Max On-Device Resolution
UHD @ 144 Hz
WQHD+ @ 180 Hz
External Display Support
8K @ 30 Hz
Tri-port MIPI interface with native Tri-fold panel structural support
HDR Standard
HDR10+, Dolby Vision, HLG

HDR10+, Dolby Vision, HLG, HDR Vivid
Video playback

Data Review:

MediaTek targets structural innovation by deploying a Tri-port MIPI display block engineered explicitly to synchronize next-generation tri-fold premium smartphone form factors.


🌐 Connectivity and Modem

Covers cellular modem capabilities, Wi-Fi standards, and network speeds

5G Modem & Wireless Connectivity

Modem Name
Snapdragon X70 5G Modem-RF system
MediaTek 3GPP-R17 5G Modem
4G/5G Support
Sub-6 GHz & mmWave nodes
Sub-6 GHz Carrier Aggregation only
Max Download/Upload Speed
Downlink: 6.5 Gbps / Uplink: 3.5 Gbps
Downlink: 7.0 Gbps / Uplink: N/A
Wi-Fi Standard
Wi-Fi 7
Wi-Fi 7
Bluetooth Version
Bluetooth 5.4
Bluetooth 6.0
Navigation

Data Review:

Qualcomm offers full global versatility with complete mmWave coverage capabilities.


Benchmarks & Performance Metrics

Analyzes synthetic test scores across popular performance benchmarking platforms

AnTuTu v11 Score

The AnTuTu Benchmark measures CPU, GPU, RAM, and I/O performance in different scenarios to reveal real-world bottlenecks and latency issues.

ParameterValue
8s Gen 31654226
Dimensity 9400+2821319

CPU

ParameterValue
8s Gen 3522202
Dimensity 9400+850513

GPU

ParameterValue
8s Gen 3434187
Dimensity 9400+1007998

Memory

ParameterValue
8s Gen 3313870
Dimensity 9400+375947

UX

ParameterValue
8s Gen 3383967
Dimensity 9400+586861

Data Review:

Dimensity 9400+ executes a massive 70.6% total system blowout, scoring 2,821,319 against Qualcomm’s 1,654,226. This victory is heavily anchored by an absolute demolition in the GPU sub-score, where MediaTek leads by a staggering 132.2%.

MediaTek’s uncompromised ultra-premium loadout handles system-wide intensive workflows in a completely superior computing tier, while Qualcomm’s scaled-back footprint limits its maximum threshold capability.

Geekbench 6

The GeekBench test shows raw single-threaded and multithreaded CPU performance, providing precise data on computational throughput and efficiency under load.

Single-Core

ParameterValue
8s Gen 31871
Dimensity 9400+2675

Multi-Core

ParameterValue
8s Gen 34702
Dimensity 9400+8463

Data Review:

MediaTek completely crushes multi-threaded logic by a monumental 80.0% margin (8,463 vs. 4,702) due to its aggressive All-Big-Core arrangement.

โ€‹The inclusion of three Cortex-X4 cores alongside a Cortex-X925 core provides an enormous multi-threaded headroom advantage for heavy compilation tasks, which traditional big.LITTLE architectures cannot match.

3D Mark

A cross-platform benchmark that assesses graphics performance in Vulkan (Metal) ensures fair GPU comparisons across operating systems and hardware configurations.

3DMark Steel Nomad Light

ParameterValue
8s Gen 31014
Dimensity 9400+2329

3DMark Solar Bay

ParameterValue
8s Gen 34988
Dimensity 9400+9176

3DMark Wild Life Extreme

ParameterValue
8s Gen 32936
Dimensity 9400+6513

Data Review:

MediaTek completely sweeps the graphics benchmark arena, claiming a massive 129.7% advantage in Steel Nomad Light and an 84.0% win in Solar Bay ray tracing.

โ€‹Immortalis-G925 GPU utilizes hardware-accelerated Opacity Micromaps to efficiently compute complex light intersections, leaving the binned Adreno 735 far behind in absolute pixel execution.

PCMark 3.0

Benchmark for evaluating overall system performance in everyday workloads ties all results together, simulating real tasks for a holistic view of responsiveness and daily computing speed clearly.

ParameterValue
8s Gen 315491
Dimensity 9400+16852

Web Score

ParameterValue
8s Gen 314944
Dimensity 9400+19324

Video Editing Score

ParameterValue
8s Gen 37691
Dimensity 9400+6828

Photo Editing Score

ParameterValue
8s Gen 30
Dimensity 9400+0

Writing Score

ParameterValue
8s Gen 30
Dimensity 9400+0

Data Review:

MediaTek secures an 8.8% total victory, but Qualcomm fights back with a 12.6% advantage in the dedicated Video Editing framework.

While MediaTek wins web scaling, the narrow delta indicates that during standard, low-intensity daily operations like application navigation and basic UI rendering, both SoCs provide a virtually identical fluid response.

🌡️ Thermals and Effeciency

Measures sustained workload stability and peak power consumption metrics

Thermals, Power Draw & Efficiency

3D Mark Stability

ParameterValue
8s Gen 387.1%
Dimensity 9400+52.0%

Power Draw

ParameterValue
8s Gen 35.8W
Dimensity 9400+11.4W

Data Review:

Qualcomm claims a major victory in long-term thermal dynamics, locking in an exceptional 87.1% stability rating against MediaTekโ€™s caving 52.0% floor.

โ€‹Snapdragon consumes a meager 5.8W under load, allowing it to sustain stable frame rates endlessly. The Dimensity spikes to a massive 11.4W, rapidly saturating small mobile cooling layouts and triggering heavy thermal throttling.


🏆 MultiCore Performance Final Verdict

CRITERIA8s Gen 3Dimensity 9400+EXPLANATION
Peak CPU Burst⭐⭐⭐⭐⭐⭐⭐⭐Dimensity. Cortex-X925 core layout secures clear math victories leading by a massive 80.0% in multi-core metrics.
Sustained Gaming⭐⭐⭐⭐⭐⭐⭐⭐Snapdragon. The Immortalis GPU commands a massive rendering peak but throttles early Snapdragon locks a stable 87.1% line over loops.
Thermal Efficiency⭐⭐⭐⭐⭐⭐⭐⭐Snapdragon. Consumes a meager 5.8W under heavy loading
Cache Integration⭐⭐⭐⭐⭐⭐⭐⭐Dimensity. An elite 19MB total localized cache structure smoothly isolates core starvation under heavy parallel workloads.
Data Memory Bandwidth⭐⭐⭐⭐⭐⭐⭐⭐⭐Dimensity. Wide 5333 MHz memory controller delivers a strong 85.3 GB/s pipeline to accelerate token processing cycles.
Connectivity Standards⭐⭐⭐⭐⭐⭐⭐⭐⭐Snapdragon. Proven X70 baseband engine supports full global mmWave band profiles with complete long-term updates.
Platform Workload Flow⭐⭐⭐⭐⭐⭐⭐⭐⭐Dimensity. Dominates overall PCMark cycles cleanly with an 8.8% performance delta advantage over standard threads.

Buy Snapdragon vs Buy Dimensity Comparison

🚀 CHOOSE THE SNAPDRAGON 8s GEN 3 IF YOU…🎮 CHOOSE THE DIMENSITY 9400+ IF YOU…
Prioritize exceptional battery longevity and cool stable performance over long gaming sessions.Demand absolute gaming dominance and extreme frame rates in next-gen mobile titles.
Want a cost-effective “flagship killer” device without paying ultra-premium component prices.Require hardware-accelerated ray tracing built on advanced Opacity Micromaps.
Rely on mature Qualcomm driver stacks for consistent third-party app emulation support.Execute local Large Language Models (LLMs) that rely on a massive 85.3 GB/s memory bandwidth.
Need full global network connectivity with total integrated mmWave coverage capabilities.Capture ultra-high-resolution media files using cinematic 8K at 60 FPS recording tools.

The Bottom Line: Final Summary

Efficiency King: Qualcommโ€™s binned Snapdragon 8s Gen 3 excels at thermal restraint, consuming half the peak power (5.8W) of its rival to deliver an exceptional 87.1% gaming stability rating.
Raw Compute Leviathan: The Dimensity 9400+ destroys synthetic records, capturing an 80.0% advantage in multi-core metrics via its second-generation All-Big-Core layout.
Next-Gen Graphics Domination: MediaTekโ€™s 4.95 TFLOPS Immortalis GPU sweeps the 3DMark suite, leading raw rasterization and ray-tracing calculations by up to 132%.
Bypassing Memory Walls: A massive 19MB effective cache hierarchy combined with an 85.3 GB/s RAM pipeline keeps MediaTek’s on-device NPU running smoothly without stalling.
Premium Content Creation: The Imagiq 1090 ISP enables ultra-high-resolution 320MP camera integration and full 8K video capture at 60 FPS, completely outclassing Qualcomm’s binned 4K ceiling.
Strategic Choice: For an affordable, reliable, and battery-smart powerhouse, choose the Snapdragon; for uncompromised tech leadership and desktop-class peaks, the Dimensity rules supreme.

💡 Pro Tip For Users

Snapdragon 8s Gen 3 owners:

Use the phoneโ€™s builtโ€‘in Game Mode to lock adaptive refresh rates and disable background sync during play โ€” this preserves battery and avoids microโ€‘stutter. For extra cool operation, avoid charging and gaming simultaneously; if you must, enable batteryโ€‘bypass charging (where available) to keep heat away from the battery.

Dimensity 9400+ owners:

To reduce thermal throttling during long sessions, lower graphics settings from โ€œUltraโ€ to โ€œHighโ€ or cap the frame rate at 60fps in the gameโ€™s menu. A clipโ€‘on phone cooler dramatically helps sustain peak frame rates and protects battery health. Also schedule heavy AI or rendering tasks when the device is idle and on a cool surface.

Both platforms:

After a major system update, clear the system cache partition (via recovery mode) and let the phone idle on Wiโ€‘Fi for an hour to complete background optimization. This simple habit can recover up to 5% of storage speed and restore outโ€‘ofโ€‘box fluidity.

Hardware Environment: Real-world testing data was compiled using retail mass-production variants of the Xiaomi Poco F6 (representing the Snapdragon 8s Gen 3) and the Oppo Find X8s (representing the MediaTek Dimensity 9400+).
System Architecture: To maintain a fair testing standard, the Poco F6 was benchmarked utilizing a standard 12GB LPDDR5X / 256GB UFS 4.0 standard, while the ultra-premium Oppo Find X8s was evaluated at its peak threshold utilizing a 16GB LPDDR5X / UFS 4.1 configuration.
Environmental Baselines: All comparative laboratory test sweeps across AnTuTu v11, Geekbench 6, and the 3DMark suite were conducted inside a specialized climate-controlled tracking chamber locked to a precise ambient temperature of 25ยฐC.
Dynamic Telemetry: Devices were baseline-calibrated to a locked display luminance of 200 nits using external lux meters, with all background data polling disabled via active airplane mode configurations to ensure absolute statistical parity.

Mohammad Arsh Avatar

Mohammad Arsh

Tech Reviewer Founder & Publisher: Sole operator and lead technical architect of MultiCore Performance
Fact Checked & Editorial Guidelines
Reviewed by: Subject Matter Experts
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9 Comments
Mr. Silicon
Mr. Silicon
July 20, 2026 5:22 am

Very nice

Preston3023
Preston3023
July 19, 2026 4:00 am
Marisa1883
Marisa1883
July 19, 2026 2:34 am
Ansh
Ansh
July 18, 2026 5:07 pm

Very nice comparison